Hardware Podcasts

Episode 38: The Future of Transistor Design and Advanced Packaging

The Circuit · 16 Oct 2023 · 33m · Episode 40

What this episode covers

Huiming Bu from IBM Research discusses the future of transistor design and advanced packaging with host Ben Bajarin. They explore the industry's transition from FinFET to nanosheet architectures and the emergence of 3D scaling via Vertical Transport FETs (VTFET) and Stacked FETs (SFET). Bu explains how chiplet technology and heterogeneous integration are accelerating compute density, allowing AMD's MI300X to reach 100 billion transistors seven years ahead of traditional scaling predictions. The conversation highlights the critical need for System Technology Co-optimization (STCO) and new EDA tools to manage the complexity of 2.5D and 3D IC designs.

Most relevant to

large enterprises

Topics

Mentioned

Companies
IBM Research, Intel, AMD, Apple, TSMC, Samsung, ASML
Products
MI300X, A17 Pro
Tools
EUV, NAU

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