Hardware Podcasts

Transforming Compute Possibilities with Multi-Die Systems

EE Times Current · 3 Mar 2023 · 24m

What this episode covers

Shekhar Kapoor, Senior Director of Product Line Management at Synopsys, explains the industry's shift from monolithic SoCs to multi-die systems, driven by the limits of Moore's Law and the demand for high-performance computing. He details how technologies like 3D stacking, fan-out wafer scale, and the UCIE standard enable modular, heterogeneous integration for products like the Apple iPhone 15 camera and Tesla's Autopilot. Kapoor highlights Synopsys' role in providing the TDC compiler and comprehensive IP portfolios to facilitate this transition, noting over 100 active multi-die designs currently in development across AI, automotive, and data center markets.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Synopsys, Apple, Tesla, AMD, Intel, Sony
Tools
TDC Compiler
Also
UCIE

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