Hardware Podcasts

Episode 111: Talking Chips and Wafers with Chips and Wafers

The Circuit · 31 Mar 2025 · 55m · Episode 112

What this episode covers

Simi Sherman and Chaim Eisenberg, founders of the semiconductor data analytics firm Chips and Wafers, explain how they aggregate granular, timely data to help investors predict company performance and industry trends. They discuss specific methodologies, such as tracking memory IC exports from Korea to Taiwan to model TSMC's CoWoS capacity, and using Besi's Malaysia-to-China shipments to forecast quarterly misses. The conversation also covers the industry's shift from monolithic SoCs to disaggregated chiplets, highlighting the increasing complexity and cost of ABF substrates and the rising importance of backend packaging.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
Chips and Wafers, TSMC, NVIDIA, Broadcom, Alchip, Besi, Kulicke and Soffa, Ibiden, Shinko, AT&S, Unimicron, Intel, AMD, Hynix, Micron, Samsung, ASML, Applied Materials, Lam Research
Materials
ABF Substrate

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