Hardware Podcasts

Returning from Mars (Matt Damon Redux) | Apple & the Sun King | Chip Packaging

EE Times Current · 11 Oct 2019 · 33m

What this episode covers

Kevin Crewell of Curious Research details TSMC's advanced packaging innovations, including 2.5D, 3D stacking, and SOIC, explaining how chiplets and heterogeneous integration address diminishing returns from Moore's Law. Bellagio Ojo and Junko Yoshida analyze the impact of US-China trade wars on electronics forecasting, highlighting how political whims, such as Apple's tariff exemption, create unpredictable business environments. George Leopold discusses the engineering challenges of Mars missions, specifically focusing on Relativity Space's proposal to use 3D printing with in-situ resources to solve the return-from-Mars problem.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
TSMC, Relativity Space, Apple, Intel, Cerebus, Micron, Xylox
Also
SOIC, EUV

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