Hardware Podcasts

Episode 3: Moore's Law and Process vs. Packaging

The Circuit · 16 Jan 2023 · 40m · Episode 3

What this episode covers

Ben Bajarin and Jay Goldberg discuss the economic and technological challenges facing semiconductor foundries like Intel, TSMC, and Samsung as Moore's Law slows. They analyze Intel's loss of process leadership, Samsung's structural challenges in the 3nm era, and the shifting industry focus from raw transistor density to advanced packaging and chiplet architectures. The hosts also explore how vertical integration gives Apple a competitive advantage over companies like Intel and Qualcomm that must serve broader, lower-common-denominator markets.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Intel, TSMC, Samsung, Apple, Qualcomm, AMD, NVIDIA, GlobalFoundries, UMC
Products
M1, Snapdragon 8, MI 100
Also
FinFET, Gate-All-Around, RibbonFET

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