IMEC & the End of the Road(map) | EDS and the Trade War | Restoring Notre Dame

EE Times Current · 17 May 2019 · 15m

What this episode covers

Rick Merritt reports from IMEC's Future Summits in Antwerp, detailing a semiconductor roadmap that may halt at 2 nanometers due to shrinking gate lengths and metal pitches, while TSMC, Samsung, and Intel compete with unique packaging and transistor techniques. Barb Jorgensen covers the Electronic Distribution Show (EDS) in Las Vegas, highlighting industry skittishness over US-China trade war tariffs and their impact on component costs and supply chain delays. Brian Santow and graphics experts Jon Peddie and Kathleen Maher discuss using advanced imaging, laser scanning, and CAD tools to restore Notre Dame, debating whether to replicate the original design or reimagine it with modern materials like steel and titanium.

Mentioned

Companies
IMEC, TSMC, Samsung, Intel, Maury Corporation, TTI, World Monuments Fund, Northeastern, Septon, Vassar, Miassi's, Studio NAB
Also
Electronic Distribution Show, Louvre

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