Hardware Podcasts

The State of Multi-Die Testing: Essential Insights for Designers

EE Times Current · 30 May 2025 · 26m

What this episode covers

Faisal Goriawala, principal product manager at Synopsys, explains the complexities of multi-die testing for 2.5D and 3DIC packages, distinguishing it from traditional monolithic testing by highlighting the need for pre-bond, mid-bond, and post-bond stages. He details how IEEE 1838 standardizes access to DFT and security features across chiplets, enabling Silicon Lifecycle Management (SLM) for in-field health monitoring and predictive maintenance. Goriawala cites Synopsys' collaboration with TSMC on a 2.5D demo vehicle and a success story with Socionex, where SLM solutions enabled high-speed HBM testing and repair without impacting logic die size.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Synopsys, TSMC, Socionex, ARM
Products
TestMax, STAR
Also
IEEE 1838, UCIe, HBM

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