Hardware Podcasts

Advanced Packaging & Chiplet Design with Chipletz

OnTrack · 13 Mar 2026 · 37m · Episode 335

What this episode covers

Stephen Newberry, Victor Kronberg, and Ching-Ping Wong from Chipletz, a fabless advanced packaging company, discuss their technical paper presented at DesignCon on the wallstrip transmission line. They explain how this novel die-to-die interconnect structure eliminates the need for a silicon interposer, reducing layer count and cost while improving insertion loss and enabling higher data rates (up to 58 GT/s) for UCIE interfaces. The team highlights the signal integrity challenges of managing crosstalk in this tall, vertical trace configuration and discusses the significant hurdles preventing an open chiplet marketplace, such as lack of standardization and limited assembly capabilities for fine-pitch dies.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
Chipletz, Siemens, Minor Graphics, Calumet
Also
DesignCon, UCIE, Digi-Key

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