Hardware Podcasts

The Impact of UCIe on Multi-Die Systems

EE Times Current · 31 Mar 2023 · 21m

What this episode covers

Manmeet Walia, Product Management Director at Synopsys, explains how the Universal Chiplet Interconnect Express (UCIe) standard addresses die-to-die connectivity challenges in multi-die systems. He details the technical metrics of PPA+L (Power, Performance, Area, Latency) and contrasts UCIe with proprietary standards like NVLink and other alliances like OIF and OCP. Walia discusses the evolving packaging landscape, from organic substrates to interposers, and highlights Synopsys' comprehensive EDA and IP portfolio designed to support this transition across server, AI, and automotive applications.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Synopsys, Nvidia, ASML, Applied Materials, Intel, AMD, Apple, Amazon, TSMC, Samsung, ASE
Products
Zebu
Also
UCIe, NVLink, OCP, OIF, Chips Alliance, AIB

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