High-Speed Interconnects for AI & Physical AI with Samtec
Matt Burns, Director of Technical Marketing at Samtec, discusses the evolution of high-speed interconnects for AI data centers and embedded systems. He explains how connector selection has shifted from an afterthought to a critical early-stage architectural decision to support data rates of 112G, 224G, and 448G. The conversation covers specific product families like Sci-Flex LP, Accelerated HP, and Sci-Flex HD, and details the move toward co-packaged copper and optics to reduce signal loss. Burns also explores how these high-speed technologies are trickling down to 'physical AI' applications in robotics and edge computing.