The State of Multi-Die: Insights and Customer Requirements

EE Times Current · 7 Nov 2025 · 20m

What this episode covers

Shaker Kapur, Executive Director of Productline Management for the Synopsys EDA Group, discusses the industry shift toward multi-die design driven by the strategic collaboration between OpenAI and AMD. He explains how this partnership, involving up to 6 gigawatts of AMD Instinct GPUs, highlights the necessity of co-optimizing hardware and software to meet exploding AI compute demands. Kapur details how Synopsys addresses these challenges through its 3DIC Capital platform, which unifies multi-die architecture exploration and system-level analysis to enable scalable, power-efficient data center architectures.

Other shows on the same ground, closest first.

  • Moore's Lobby · 55m

    Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations

    John Koeter, Senior Vice President of IP at Synopsys, discusses the evolution of semiconductor intellectual property, the shift to multi-die chiplet architectures, and the transformative role of AI in chip design. He details Synopsys' acquisition of Ansys to enhance thermal modeling for 3D ICs, the challenges of managing heat in stacked dies, and the critical importance of software ecosystems for emerging architectures like RISC-V. Koeter also offers career advice on adaptability and leveraging AI as a force multiplier for engineers.

  • The Circuit · 43m

    Ep 160: More good News for Intel, AI Model Trends, Future of Datacenter

    Ben Bajarin and Jay Goldberg analyze Intel's recent strategic moves, including a partnership with Tesla for its 'Terafab' project and co-design work with Google on its IPU, interpreting these as validation for Intel's advanced packaging and foundry capabilities. They discuss the broader semiconductor market's valuation disconnect, noting how investors are shifting focus from established compute giants to obscure optical and mineral supply chain bottlenecks. The hosts also examine the future of data centers, arguing that extreme co-optimization of power (800 VDC) and cooling is becoming essential to unlock compute capacity, and cover Anthropic's rapid product rollout, including its Word connector and 'Mythos' model, while highlighting rising token costs and capacity constraints.

  • Oxide and Friends · 1h 14m

    AMD's MI300 and the Future of Accelerated Compute

    George Cozma of Chips and Cheese and Jordan Cozma of Storage Review join Bryan Cantrill and Adam Leventhal of Oxide Computer Company to analyze AMD's MI300 series, particularly the MI300A APU. The group compares AMD's unified memory architecture and open-source ROCm software stack against NVIDIA's Grace Hopper and CUDA ecosystem, discussing the implications for accelerated compute, data center power density, and the future of AI hardware.

  • The Circuit · 48m

    EP 137: OpenAI + AMD, Intel Tech Touch, QCOM buys Arduino

    Ben Bajarin and Jay Goldberg discuss OpenAI's strategic partnership with AMD, analyzing the financial implications of OpenAI's $100 billion capex plan and its ambition to become a hyperscaler. They examine Intel's recent 'Tech Touch' event, highlighting the capabilities of its Fab 52, the 18A process node, and the architectural shifts in Panther Lake and Clearwater Forest chips. Finally, they evaluate Qualcomm's acquisition of Arduino as a move to consolidate its position in the industrial IoT ecosystem.

  • The Circuit · 34m

    Episode 81: Chatting With AMD's Forrest Norrod EVP Datacenter Solutions about Buying ZT Systems

    Forrest Norrod, AMD's EVP of Datacenter Solutions, explains the strategic acquisition of ZT Systems to integrate high-level system design with AMD's EPYC CPUs and Instinct GPUs. Norrod details how ZT's expertise in designing customized infrastructure for hyperscalers like Microsoft and AWS allows AMD to optimize silicon and system design concurrently, accelerating time-to-market for AI servers. The hosts discuss the financial strategy of divesting ZT's manufacturing assets to focus on design, the competitive implications of AMD's open ecosystem versus Nvidia's closed stack, and the shifting dynamics of hyperscaler in-house design trends.

The summary, chapters and topics are generated from the episode’s audio by this directory, not written by EE Times Current. The episode itself belongs to its publisher.