Episode 35: The State of Intel via Their Innovation Summit
Ben Bajarin and Jay Goldberg analyze Intel's Innovation Summit, noting the lack of major product announcements and the confirmation that Intel's 20A and 18A manufacturing processes are on track. They discuss Intel's strategic pivot to AI-integrated CPUs (Meteor Lake) and its Foundry Services (IFS) packaging capabilities, specifically the move to glass substrates and chiplet designs. The hosts conclude that while Intel's packaging is competitive, its core lithography process remains the critical factor for regaining market share against NVIDIA and AMD in a newly fragmented semiconductor landscape.