Intel on Getting Its Mojo Back

EE Times Current · 30 Jul 2021 · 29m

What this episode covers

Intel SVP Sanjay Natarajan explains the company's IDM 2.0 strategy and detailed technology roadmap, aiming to regain manufacturing leadership by 2025 through innovations like RibbonFET and PowerVia. He highlights Intel Foundry Services (IFS) partnerships with AWS and Qualcomm, emphasizing Intel's unique 'one-stop-shop' capability combining process, packaging, and software. Natarajan details how backside power delivery (PowerVia) and High-NA EUV lithography will improve power efficiency and density, targeting parity with TSMC and Samsung by 2024 and leadership by 2025.

Mentioned

Companies
Intel, TSMC, Samsung, AWS, Qualcomm, ASML, Applied Materials
Products
RibbonFET, PowerVia, Foveros, EMIB, Intel Foundry Services
Tools
High-NA EUV
Also
Sanjay Natarajan

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