Episode 35: The State of Intel via Their Innovation Summit

The Circuit · 25 Sept 2023 · 34m · Episode 37

What this episode covers

Ben Bajarin and Jay Goldberg analyze Intel's Innovation Summit, noting the lack of major product announcements and the confirmation that Intel's 20A and 18A manufacturing processes are on track. They discuss Intel's strategic pivot to AI-integrated CPUs (Meteor Lake) and its Foundry Services (IFS) packaging capabilities, specifically the move to glass substrates and chiplet designs. The hosts conclude that while Intel's packaging is competitive, its core lithography process remains the critical factor for regaining market share against NVIDIA and AMD in a newly fragmented semiconductor landscape.

Other shows on the same ground, closest first.

  • EE Times Current · 29m

    Intel on Getting Its Mojo Back

    Intel SVP Sanjay Natarajan explains the company's IDM 2.0 strategy and detailed technology roadmap, aiming to regain manufacturing leadership by 2025 through innovations like RibbonFET and PowerVia. He highlights Intel Foundry Services (IFS) partnerships with AWS and Qualcomm, emphasizing Intel's unique 'one-stop-shop' capability combining process, packaging, and software. Natarajan details how backside power delivery (PowerVia) and High-NA EUV lithography will improve power efficiency and density, targeting parity with TSMC and Samsung by 2024 and leadership by 2025.

  • EE Times Current · 42m

    The CHIP Act’s Blind Spot | A Lifeline for Intel | I Just Saw a Face

    Adam Khan, founder of Akhan Semiconductor, and Vice Admiral Charles Moore discuss the need for U.S. legislation to support wide-bandgap semiconductors like diamond, gallium nitride, and silicon carbide, arguing that focusing on these materials allows the U.S. to leverage existing 200mm fabs rather than chasing expensive EUV lithography. The episode also analyzes Intel CEO Bob Swan's ambiguous statements regarding process technology, with journalist Balaji Rao arguing that Intel should pivot to a full-time foundry model to maintain technological sovereignty and compete with TSMC, rather than outsourcing to Taiwan.

  • EE Times Current · 43m

    Headline: Intel Throws a Curveball | The Book on Gallium Nitride

    Analysts Jim McGregor and Kevin Krewell of Tirias Research explain Intel's decision to establish a standalone foundry business, detailing the $20 billion investment, the separation from Intel's IDM operations, and the strategic collaboration with IBM on nanosheet technology. They discuss the challenges of competing with TSMC and Samsung, the importance of packaging expertise like Foveros and EMIB, and the need for immediate execution on 7nm processes. Additionally, EE Times editors Nitin Khanna, Dahad, and Maurizio de Paulo Emilio preview the new Aspencore Guide to Gallium Nitride, highlighting its applications in power electronics, EVs, and fast chargers, and its role as a reference for wide bandgap semiconductors.

  • EE Times Current · 15m

    Intel CPU |5G Fixed Wireless | AI Silicon Race | SMIC Rift

    Phil Williams hosts an EE Times briefing covering four major industry developments. Dylan McGrath analyzes how Intel's CPU shortage is allowing AMD to capture market share in the PC sector. Editor-in-Chief Brian Santo critiques AT&T and Verizon's premature 5G fixed wireless rollout, citing poor business cases and technical shortcomings. The episode also features Junko Yoshida and Rick Merritt discussing the competitive AI silicon landscape, highlighting NVIDIA's dominance and emerging players, before concluding with a report on management turmoil at SMIC and its implications for China's domestic DRAM strategy.

The summary, chapters and topics are generated from the episode’s audio by this directory, not written by The Circuit. The episode itself belongs to its publisher.