EE Times Current · 24 Jul 2020 · 39m
Junko Yoshida discusses Ford's strategic decision to partner exclusively with Mobileye for its global ADAS lineup, highlighting Mobileye's Road Experience Management (REM) crowdsourcing ecosystem and the shift in automotive supplier relationships. Tom Wong, Director of Marketing at Cadence Design Systems, explains the industry's transition from Moore's Law to 'More Than Moore' and 'Beyond Moore,' focusing on multi-chip modules, advanced packaging, and the economic drivers of disaggregated SoCs in data centers. The episode also covers the historical significance of the SRN1 hovercraft, detailing its engineering by Saunders-Roe and its role as the first practical hovercraft.
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Host Daniel Bogdanoff previews Season 5 of Moore's Lobby, highlighting upcoming episodes with Steve Cozier of Skywater Technology, AMD's Sam Napstigger, and Intel's Wei Li. The trailer outlines discussions on the foundry business model, implementing power management ICs via microcontroller backdoors, and optimizing AI software performance on Intel platforms.
Host Daniel Bogdanoff introduces Season 4 of Moore's Lobby, previewing episodes with Jonathan Ross of Grok and Hugo Swartz of Qualcomm. Ross explains how Grok's chip architecture achieves peta-op performance by combining CPU speed with GPU throughput on older technology. Swartz discusses Qualcomm's evolution from modem and audio components to a comprehensive compute platform integrating CPU, GPU, DSPs, and camera processors for XR and metaverse applications.
Hosts Chris Gammell and Dave Jones discuss the challenges of sourcing components like custom LCDs and LEDs, the history of Tektronix's microfiche archives, and the engineering and regulatory hurdles facing self-driving cars following an Uber fatality. They also touch on industry news regarding Apple's shift away from Intel, Tesla's financial struggles, and the expansion of the Hardware Happy Hour community.
Ben Bajarin and Jay Goldberg discuss the economic and technological challenges facing semiconductor foundries like Intel, TSMC, and Samsung as Moore's Law slows. They analyze Intel's loss of process leadership, Samsung's structural challenges in the 3nm era, and the shifting industry focus from raw transistor density to advanced packaging and chiplet architectures. The hosts also explore how vertical integration gives Apple a competitive advantage over companies like Intel and Qualcomm that must serve broader, lower-common-denominator markets.
Aart de Geus, co-founder and executive chair of Synopsys, discusses the evolution of electronic design automation (EDA) and the future of silicon design. He explains how the industry shifted from analog to digital design, enabling the automation that drove Moore's Law, and details the transition to the Angstrom era with technologies like FinFETs and backside power delivery. De Geus also highlights the rise of systemic complexity through chiplets and vertical stacking, and the critical role of AI in optimizing these complex multi-die architectures.
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