Hardware Podcasts

UHDI, AI, and Solder Paste Innovation

OnTrack · 4 Feb 2025 · 51m · Episode 289

What this episode covers

Tony Lentz, Chemist and Field Application Engineer at FCT Assembly, discusses the technical challenges of Ultra-High Density Interconnect (UHDI) PCB assembly with host Zach Peterson. They cover the necessity of Type 6 and Type 7 solder powders for fine-pitch components, the resulting issues with oxidation, flux residue, and dendritic growth, and the critical role of cleaning and precise equipment calibration in maintaining yield.

Most relevant to

established companies

Topics

Mentioned

Companies
FCT Assembly, SMTA, Digi-Key, Autotech
Materials
SAC 305

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