Hardware Podcasts

What's Driving the Next Wave of Electronics Engineers?

OnTrack · 31 Jan 2025 · 39m · Episode 288

What this episode covers

Paul Cooke, Director of Application Engineering at AGC Multi Materials, discusses the critical role of advanced materials in Ultra HDI (UHDI) PCB manufacturing and the challenges facing the North American electronics supply chain. He explains how AGC is developing non-reinforced, low-CTE resin systems to eliminate glass-related issues like skew and flatness problems in high-density designs. Cooke also highlights the severe workforce shortage in the industry, noting that the number of US board shops has dropped from over 2,000 to roughly 140, and argues for greater government and military investment to revitalize domestic manufacturing capacity.

Most relevant to

large enterprises

Topics

Mentioned

Companies
AGC Multi Materials, SMTA, Intel, Tesla
Products
Fast Rise TC, Easy Pure
Materials
PTFE, Teflon

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