What Will the Future Hold for Ultra HDI in PCB Design?

OnTrack · 30 Jan 2025 · 41m · Episode 287

What this episode covers

Tara Dunn, Director of Training and Education at SMTA, discusses the evolution of Ultra High Density Interconnect (UHDI) technology with host Zach Peterson. They explore the technical distinctions between SAP and MSAP processes, the critical need for communication between PCB designers and fabricators to avoid assembly defects, and the blurring line between PCBs and semiconductor packages. The conversation highlights SMTA's role in fostering industry collaboration through its UHDI Symposium and educational resources, while addressing the challenges of workforce training and the potential for increased private investment in US PCB fabrication.

Mentioned

Companies
SMTA, Veritech, Renesas
Also
PCB East, PCB West, PCIA, PCBAA, Defense Electronics Consortium, IPC, Chris Shay, Digiki, Altium BI, CHIPS Act, PCB Act, NDAA

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