Hardware Podcasts

Ergs Per Second

The Amp Hour · 11 Nov 2018 · 1h 11m · Episode 415

What this episode covers

Chris Gammell of Contextual Electronics and Dave Jones of EEVblog discuss recent conference highlights, including Ben Krasnow’s circuit-on-plastic technology and Robert Nelson’s thermal projection hack. They dive deep into the engineering of thin and flex PCBs, noting how reduced dielectric thickness allows for narrower traces while maintaining impedance, and the complexities of rigid-flex assembly. The conversation shifts to practical manufacturing challenges, with Gammell detailing his struggles using a Neoden 4 pick-and-place machine, specifically regarding Z-height calibration and panel warping, while Jones explains the necessity of custom carriers for large panels. Finally, they touch on Jones’s decision to switch from an extruded to a die-cast case for his Micro Supply to simplify assembly and improve thermal management.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
Contextual Electronics, EEVblog
Products
Ninja Blocks, Micro Supply
Chips
Grid-Eye
Tools
Neoden 4, KiCad, Altium
Also
Ben Krasnow, Robert Nelson

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