Hardware Podcasts

Unpacking Semiconductor Packaging: Insights with Jan Vardaman

OnTrack · 23 Apr 2024 · 30m · Episode 263

What this episode covers

Jan Vardaman, president and founder of TechSearch International, explains that advanced semiconductor packaging and substrate manufacturing are concentrated in Asia, with high-end operations in Taiwan, Korea, and Japan, while the U.S. lacks comparable scale. She details the challenges of the National Advanced Packaging Manufacturing Program (NAPMP), noting that establishing a viable U.S. supply chain requires significant investment in clean rooms, metrology, and workforce development to achieve the high yields necessary for economic viability. Vardaman argues that policy efforts must focus on creating a complete ecosystem—including substrate fabrication and assembly—rather than just semiconductor fabs, and emphasizes the need for customer buy-in and small business innovation to drive commercial-scale production.

Most relevant to

large enterprises

Topics

Mentioned

Companies
TechSearch International, IPC, TSMC, Apple, Skywater, IBM, Amkor
Also
National Advanced Packaging Manufacturing Program, Arizona State University, CEA Leti

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