Moore's Lobby podcast cover art

Moore's Lobby

Host Daniel Bogdanoff talks with the engineers and executives behind the industry's biggest technology trends, telling the human stories behind the circuits.

100 episodes · 84 hours · since 2020

Moore's Lobby is filed under electronics, engineering and interviews. Its most recent episode published on , so it is still actively publishing. Listeners have left 25 ratings on Apple Podcasts, averaging 4.9 out of 5.

Latest episodes

The 10 newest episodes of Moore's Lobby, each with a summary and chapters.

  • · 55m

    Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations

    John Koeter, Senior Vice President of IP at Synopsys, discusses the evolution of semiconductor intellectual property, the shift to multi-die chiplet architectures, and the transformative role of AI in chip design. He details Synopsys' acquisition of Ansys to enhance thermal modeling for 3D ICs, the challenges of managing heat in stacked dies, and the critical importance of software ecosystems for emerging architectures like RISC-V. Koeter also offers career advice on adaptability and leveraging AI as a force multiplier for engineers.

  • · 53m

    What's Next in Wireless Communication? An Insider's Perspective

    Joaquin Torrecilla, VP of software transformation at Keysight, discusses the evolution of wireless standards from early Bluetooth to 5G Advanced and the emerging 6G era. He details critical 5G capabilities including Non-Terrestrial Networks (NTNs) with LEO satellites, Network Slicing, and Time-Sensitive Networking (TSN), while explaining how RedCap optimizes IoT connectivity. Torrecilla also highlights Keysight's shift from proprietary hardware to virtualized software stacks and the integration of AI-native architectures in next-generation networks.

  • · 56m

    Embedded Intelligence: Insights From An Industry Pioneer

    Christian Eder, co-founder and Director of Market Intelligence at congatec, discusses the evolution of Computer-on-Modules (COMs) and the strategic importance of open standards like COM-HPC. He details the founding of congatec from JumpStart, the challenges of early product launches, and the company's growth into a global leader in embedded computing. Eder explains how modular designs accelerate development, mitigate supply chain risks, and enable edge AI processing in diverse environments from medical devices to aerospace.

  • · 56m

    Solving the Hard Problems: Combining AI and Physics for PCB Design

    Sergiy Nesterenko, founder and CEO of Quilter, explains how his company uses reinforcement learning and computational physics to automate PCB layout, aiming to create a 'compiler' for electronics that handles the entire design scope. He recounts his early career at SpaceX, including an internship watching paint dry and a subsequent board fire that highlighted the reliance on tribal knowledge and the failure of traditional auto-routers. Nesterenko details Quilter's workflow, which integrates with existing CAD tools like Altium to generate layouts for test boards and complex single-board computers, while acknowledging current limitations with high-voltage or ultra-dense server designs. The discussion covers the technical strategy of using neural networks to interpolate simulation results, the company's focus on iterative complexity scaling, and a 10-year vision for enabling continuous integration in hardware design.

  • · 53m

    Sensing at the Control Level: Leveraging Data for Both Safety and Analytics

    Kate Sokolnicki, Global Business Director for Rockwell Automation's Sensing & Safety business unit, explains the shift from simple on/off sensors to smart devices providing dual-channel process and health data. She details how IO-Link and GuardLink protocols enable condition monitoring and precise fault identification in daisy-chained safety systems, reducing troubleshooting time. Sokolnicki emphasizes that while AI and vision systems are commoditized, their value depends on robust metadata and edge computing, urging young engineers to prioritize practical 'back-of-the-napkin' math over pure theory.

  • · 56m

    Sensors Insights: Bridging Hardware Collection and Software Analysis

    Nils Beckmann, Director of Engineering for Intelligent Automation at Emerson, discusses the convergence of hardware and software in industrial IoT. He explains that while sensors are the critical data source, the primary challenge is bridging the skill gap between hardware engineers who lack software knowledge and software engineers who misunderstand physical constraints. Beckmann advises starting with simple monitoring of existing sensors to establish baselines before attempting complex predictive maintenance, emphasizing that repeatability is often more valuable than high accuracy for analytics.

  • · 57m

    Industrial Sensors: The Building Blocks That Lead to Process Optimization

    Salim Dabbous, Director of Consulting & Digital Solutions at SICK, discusses the practical implementation of industrial sensors for condition monitoring and digital transformation. He outlines the critical steps for automation engineers, from selecting the right team (controls, process, IT) to running 30-90 day pilots that prove ROI before scaling to full production lines. Dabbous emphasizes that successful IoT adoption requires aligning hardware capabilities with existing PLC and ERP systems while managing the cultural shift toward data-driven decision-making.

  • · 41m

    Powering EVs: Microgrids & DC Charging Solutions

    Antonio Di Vaira, Senior VP for Power Products at Schneider Electric, discusses the critical need for grid modernization driven by EV charging and AI data centers. He explains how microgrids and native DC distribution offer efficiency and resilience solutions, citing a pilot project at Schneider's Raleigh campus. Di Vaira also highlights the company's 'Flexset' switchboard, a modular, kit-built product designed to reduce lead times and empower electricians, while emphasizing the importance of multidisciplinary engineering and customer-centric design.

  • · 50m

    Material Science in Motion: How 3M is Powering EV and Grid Advancements

    Mike Stroman, 3M's global R&D director for the electrical markets division, explains how the company's material science innovations are addressing critical challenges in electric vehicle (EV) motors and battery packs. He details specific technologies such as high-temperature adhesives for thermal runaway safety, expandable slot liners for motor cooling, and adhesively bonded laminates to reduce eddy currents. Stroman also discusses 3M's use of digital twins to accelerate R&D cycles and the company's '15% time' philosophy that fosters breakthrough products like ACCR cables and passive radiative cooling films.

  • · 56m

    Aligning Passion With Purpose: A Journey to Electrification and Sustainability

    Dr. Mital Kanabar, Senior Director of Innovation at GE Vernova, discusses the 'energy trilemma' of security, affordability, and sustainability as power demand surges from EVs and AI data centers. He explains how GE Vernova's GridBeats platform uses software-defined automation and edge AI to manage bidirectional power flow and grid stability without massive hardware upgrades. The conversation covers the role of small modular reactors (SMRs), cybersecurity in operational technology, and the workforce challenges facing the utility industry.

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