Hardware Podcasts

This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

EE Times Current · 6 Nov 2020

What this episode covers

Altair SVP Pete Darnell explains the complexity of 'megatronics'—combining mechanical, electronic, and software models—and shares a case study where inaccurate physical assumptions forced daily model updates for a large haptic device. Don Scansen discusses a new collaboration between CEA Leti and Intel to develop 3D packaging and active interposer technology for high-performance computing. The episode also covers the historical significance of the Morris Worm, which took down 10% of the early internet and led to the creation of CERT.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
Altair, CEA Leti, Intel, Xilinx, AMD, NVIDIA, ARM
Also
Morris Worm

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