Hardware Podcasts

Embedded World in Nuremberg | Mobile World Congress in Barcelona

EE Times Current · 1 Mar 2019 · 12m

What this episode covers

Junko Yoshida reports from Mobile World Congress in Barcelona, highlighting Qualcomm's 5G dominance with the Snapdragon 855 and X55 modem, the rise of foldable phones from Samsung and LG, and the geopolitical tensions surrounding Huawei. Meanwhile, Nitin Dhad and Bolaji Ojo cover Embedded World in Nuremberg, discussing the convergence of 5G, AI, and robotics, with Colcom launching a $499 robotics kit and Arm/Vodafone extending their IoT collaboration. The hosts emphasize the industry-wide shift toward hardware root of trust for security and the severe implications of US-China trade relations on the global electronics supply chain.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Qualcomm, Keysight, Samsung, LG, Huawei, Colcom Technologies, Arm, Vodafone, Maxim, Infineon, ST, NXP, Microchip, Arrow, Greenhill, Secure Things, Intel, GlobalFoundries
Products
Pelion IoT
Chips
Snapdragon 855, X55

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