Hardware Podcasts

TSMC Scraps a Batch of Wafers | AI Limitations | ISSCC

EE Times Current · 22 Feb 2019 · 7m

What this episode covers

Alan Patterson reports that TSMC scrapped a batch of 12 and 16 nanometer wafers at Fab 14B in Tainan due to substandard photo resist, cutting Q1 revenue forecasts by $550 million. Junko Yoshida highlights Noriko Arai's book 'AI versus Chutolin,' emphasizing that current AI lacks true understanding and cannot read textbooks. Dylan McGrath and Rick Merritt cover the 2019 ISSCC, noting Intel's production-ready embedded MRAM at the 22nm node and discussions on unsupervised learning.

Most relevant to

large enterprises

Topics

Mentioned

Companies
TSMC, media tech, high silicon, NVIDIA, Huawei, Cisco, Georgia Institute of Technology, Toshiba, Western Digital, Intel, GlobalFoundries, Everspin, Sandisk
Also
Noriko Arai, AI versus Chutolin, MRAM, Flash

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