The Spark Gap - Episode 47

The Spark Gap · 27 Apr 2016 · 1h 23m

What this episode covers

Speakers Carl and Corey discuss the ST L9779WD multifunction IC for engine management, highlighting its BCD 6S process technology and Micro2nd Channel interface, alongside the Texas Instruments TSU6111A USB/UART mux chip for firmware update workflows. They then analyze thermal management in embedded design, explaining how temperature coefficients (tempco) affect component behavior, leading to issues like BJT thermal runaway and crystal drift. The hosts cover prevention strategies like using switching regulators, detection methods using thermistors and digital sensors, and cooling solutions ranging from PCB copper pours and heat sinks to active fans and liquid cooling.

Mentioned

Companies
ST, Infineon, Texas Instruments, Maxim Integrated
Chips
L9779WD, TSU6111A

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