Hardware Podcasts

Episode 86: Intel's Inflection Point? Analyzing the Intel Plan.

The Circuit · 23 Sept 2024 · 47m · Episode 86

What this episode covers

Ben Bajarin and Jay Goldberg analyze Intel's strategic inflection point, focusing on the company's response to activist investor pressure and the recent board meeting. They discuss the 'spin-in' of Intel Foundry, the significance of Amazon as a customer for the 18A process node, and the implications of Qualcomm's rumored interest in acquiring Intel. The hosts also explore hypothetical merger scenarios involving Qualcomm and Broadcom, while assessing the shrinking market for general-purpose CPUs in the era of AI accelerators.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Intel, Amazon, Microsoft, Qualcomm, Broadcom, TSMC, Ampere Computing
Products
18A, 14A, Panther Lake, Lunar Lake, Zion

Related episodes from other shows

Other shows on the same ground, closest first.

  • EE Times Current · 4m

    EE Times Weekly Briefing: Friday, February 1, 2019

    Rick Merritt, Silicon Valley Bureau Chief for EE Times, outlines key industry developments including Intel's appointment of Bob Swan as CEO and the company's turnaround challenges. He details the FTC's antitrust case against Qualcomm, focusing on allegations of monopoly abuse in CDMA and LTE chip markets and the potential for lower patent royalties. The briefing also covers Uber's hardware engineering stance on deep learning accelerators and Japan's government plan to hack 200 million IoT devices for the 2020 Tokyo Olympics.

    Policy, trade & tariffsChips, FPGAs & semiconductors
    5 chapters

  • EE Times Current · 41m

    Interview: AMD CTO Papermaster | Interview: Imagination CEO Black | Where to Invest in 2020

    AMD CTO Mark Papermaster discusses the company's transition to 7nm Zen architecture, chiplet-based designs like the Threadripper 3990X, and the integration of specialized accelerators for AI workloads. Imagination Technologies CEO Ron Black explains the company's strategic pivot toward automotive graphics, ray tracing, and RISC-V cores, highlighting the resumption of its partnership with Apple. EE Times editors analyze 2020 investment trends, emphasizing that data generation from apps is driving semiconductor growth, with specific focus on memory, RF front-ends, and power infrastructure in developing economies.

    Chips, FPGAs & semiconductorsAI & machine learning
    5 chapters

  • Oxide and Friends · 1h 22m

    Lip-Bu Tan's Intel

    Bryan Cantrill, Adam Leventhal, and Reuters reporter Max Cherney discuss Intel's appointment of Lip-Bu Tan as its new CEO, analyzing his mandate to overhaul manufacturing, restart AI efforts, and cut middle management. The hosts speculate on Tan's strategy regarding Intel's foundry business, potential alliances with Cadence, and the cultural challenges of turning around the company, while also sharing anecdotes about guest Bryan Russett's cooking and a 3D-printed bust of John von Neumann.

    Policy, trade & tariffsGrowth, exits & acquisitions
    6 chapters

  • EE Times Current · 34m

    Whither Semiconductors? The Wheels on the Bus Go ‘Round and ‘Round

    Jim McGregor, co-founder of Tirias Research, discusses the evolving competitive landscape of the semiconductor industry, identifying Intel, AMD, and NVIDIA (following its potential acquisition of Arm) as the new dominant trio. He explains how the convergence of computing, connectivity, and intelligence is blurring traditional boundaries, with companies like Qualcomm, Samsung, and MediaTek competing across smartphones, servers, and automotive sectors. McGregor highlights the shift toward heterogeneous computing, specialized accelerators like DPUs, and the move away from monolithic dies toward multi-chip modules and advanced packaging to overcome Moore's Law limitations.

    Chips, FPGAs & semiconductorsMechanical engineering
    8 chapters

The summary, chapters and topics are generated from the episode’s audio by this directory, not written by The Circuit. The episode itself belongs to its publisher.