419: Fission Chips
Eric Schlaepfer and Windell Oskay, authors of the book Open Circuits, discuss the process of cross-sectioning electronic components to reveal their internal structures. They detail the technical challenges of preparing samples, including resin impregnation, vacuum degassing, and hand-sanding with grits up to 10,000, as well as the macro photography techniques involving focus stacking and custom robotic rigs. The conversation covers specific components like the μA702 integrated circuit, tantalum capacitors, and cathode-ray tubes, highlighting the blend of engineering failure analysis and artistic photography.