Hardware Podcasts

419: Fission Chips

Embedded.fm · 30 Jun 2022 · 1h 03m · Episode 419

What this episode covers

Eric Schlaepfer and Windell Oskay, authors of the book Open Circuits, discuss the process of cross-sectioning electronic components to reveal their internal structures. They detail the technical challenges of preparing samples, including resin impregnation, vacuum degassing, and hand-sanding with grits up to 10,000, as well as the macro photography techniques involving focus stacking and custom robotic rigs. The conversation covers specific components like the μA702 integrated circuit, tantalum capacitors, and cathode-ray tubes, highlighting the blend of engineering failure analysis and artistic photography.

Most relevant to

makers and hobbyists

Topics

Mentioned

Companies
No Starch Press, Evil Mad Scientist Laboratory
Products
Open Circuits
Chips
μA702
Tools
Helicon Focus, AxiDraw, Canon EOS R, Processing

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