Hardware Podcasts

172 - Simon Lewis is enabling the analog to digital transformation at Highcon

People of Packaging · 8 Dec 2022 · 31m

What this episode covers

Simon Lewis, VP of Marketing at Highcon, discusses the company's Beam 2C system and its strategic collaboration with Sealed Air, which includes an $8M investment and a purchase order for a Beam 2C unit. Lewis contrasts 'A to D 1.0' (direct replacement of analog processes) with 'A to D 2.0' (transforming the entire end-to-end workflow), arguing that digital finishing is essential to unlock the value of digital printing in corrugated and folding carton markets. He explains how Highcon’s hybrid digital cutting and mechanical creasing technology eliminates the need for physical dies, enabling on-demand production, reduced waste, and lower fixed costs for short-run e-commerce packaging.

Most relevant to

companies scaling up

Topics

Mentioned

Companies
Highcon, Sealed Air, Cytech, HP Indigo, Spark Packaging
Products
Beam 2C

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