Hardware Podcasts

UHDI Innovations & Next-Gen PCBs with Kunal Shah, PhD.

OnTrack · 12 Mar 2024 · 44m · Episode 257

What this episode covers

Kunal Shah, PhD, President of liloTree, discusses the challenges of Ultra High-Density Interconnects (UHDI) and surface finish innovations for high-reliability defense and medical electronics. He explains how traditional ENIG plating causes signal integrity issues due to nickel's low conductivity and magnetic interference, as well as overplating bridging in sub-10 micron features. Shah presents liloTree's nickel-free barrier layer solution, which offers the reliability of gold without the signal loss of nickel, and contrasts it with the corrosion and dendrite risks of immersion silver and the shelf-life limitations of OSP.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
liloTree
Also
SMTA, ENIG, OSP, DIG, EPIG

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