GaN Powers Up in AI, Robotics, and Our Lives

Moore's Lobby · 18 Feb 2025 · 51m · Episode 2

What this episode covers

Alex Lidow, CEO of EPC (Efficient Power Conversion), discusses his journey from co-inventing HexFETs at International Rectifier to founding EPC to commercialize Gallium Nitride (GaN) technology. He details the physics of GaN, the early struggles with manufacturing yields, and the pivotal role of LiDAR and space electronics in driving adoption. Lidow also highlights the current tipping points in AI power supplies and the future potential of GaN in humanoid robotics.

Other shows on the same ground, closest first.

  • The Amp Hour · 1h 05m

    Inventing the Power MOSFET with Alex Lidow

    Alex Lidow, founder and CEO of Efficient Power Conversion (EPC) and former CEO of International Rectifier, recounts inventing the Power MOSFET and HEXFET while working at IR. He explains the physics of Gallium Nitride (GaN) on silicon, the founding of EPC after being fired from IR, and the company's strategic focus on low-voltage performance markets and integrated circuits for AI data centers and humanoid robots. Lidow also discusses the challenges of patent enforcement in the US versus China and the technical details of high-efficiency power topologies for next-generation NVIDIA servers.

  • EE Times Current · 25m

    Moore’s Law and GaN | Facial Recognition vs. Privacy | The Trade War Soap Opera

    EE Times editor-in-chief Brian Santo discusses the state of facial recognition technology with international editor Junko Ishida, highlighting accuracy issues in UK police trials and the lack of regulatory frameworks. Santo then speaks with international editors Junko Yoshida and Bola Ajibola about the US-China trade war, specifically the lifting of restrictions on Huawei and the resulting uncertainty for global electronics supply chains. Finally, Alex Lidow, CEO of Efficient Power Conversion (EPC), explains how gallium nitride (GaN) is overcoming the end of Moore's Law in power electronics, enabling advancements in LiDAR, autonomous vehicles, and medical devices like pill-sized X-ray cameras.

  • EE Times Current · 29m

    Life, the Universe, and Power ICs

    Doug Bailey, VP of Marketing and Applications Engineering at Power Integrations, explains the shift from silicon to gallium nitride (GaN) power ICs, highlighting how GaN's low capacitance enables smaller, more efficient power supplies. He discusses the practical cutoff for GaN adoption around 45 watts and the industry trend of removing chargers from phone boxes to reduce e-waste. Bailey argues that while GaN adapters are more expensive, their higher quality and multi-device capability provide greater value to consumers and reduce environmental impact.

  • EE Times Current · 23m

    How FIT is GaN?

    Doug Bailey, VP of Marketing and Applications Engineering at Power Integrations, explains how the company validated Gallium Nitride (GaN) technology for high-reliability applications by first deploying it in the high-volume charger market to gather real-world failure data. He details Power Integrations' decision to use depletion mode devices with cascode configurations to achieve lower costs and higher efficiency compared to enhancement mode alternatives, while also discussing the technical necessity of 750V and 900V variants for appliances and automotive systems. Bailey argues that GaN’s low parasitics allow for simpler power supply topologies, such as flyback converters at higher power levels, and predicts that GaN will eventually replace silicon in many applications due to its favorable energy processing costs.

  • The Amp Hour · 1h 10m

    Moore's Law, GaN and SiC devices - Gallimaufry GaN Gabble

    Dave Jones, Chris Gammell, and Jeff Kaiser discuss the Open Hardware Summit and Maker Faire, highlighting the Arduino team's announcement of the Arduino Leonardo and the ARM-based Arduino Due. They analyze the implications of Moore's Law slowing down, with a focus on Gallium Nitride (GaN) and Silicon Carbide (SiC) technologies enabling higher frequency switching and integrated power electronics. The conversation also covers the DirectFET2 package from International Rectifier, which uses flip-chip technology to significantly reduce thermal impedance compared to traditional D2PAK packages.

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