Hardware Podcasts

Integrating Interface Memristors in the Back End of Line

EE Times Current · 23 Oct 2026 · 42m

What this episode covers

Tamalika Banerjee and Ruben Hamming-Green, co-founders of IMChip, a spin-out from the University of Groningen, explain how their interface memristors offer greater reliability and scalability than filamentary devices by using lower voltages and preserving crystallinity during transfer. They describe a novel manufacturing process where memristors are grown at high temperatures on lattice-matched substrates and then transferred onto the back end of line (BEOL) of commercial CMOS chips, enabling integration with legacy nodes. The company aims to launch an edge-AI prototype chip within two years, targeting pilot customers to test basic AI inference before broader industry adoption. Giulia D’Angelo and Ralph Etienne-Cummings join the discussion to contextualize the technology against memcapacitors and address the challenges of neuromorphic integration.

Most relevant to

early-stage companies

Topics

Mentioned

Companies
IMChip, HP, TSMC, ASML, XFab
Also
University of Groningen, Cognagron, Johns Hopkins University, UC Santa Barbara, Portland State University

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