Hardware Podcasts

AV & ADAS: Shall the Twain Ever Meet? | AI & Academia — a Fitful Fit | SiC ‘Em

EE Times Current · 6 Dec 2019 · 40m

What this episode covers

EE Times editors Brian Santo and Junko Yoshida discuss the divergent development paths of autonomous vehicles (AV) and advanced driver-assistance systems (ADAS), noting that cost structures and liability models prevent a linear transition from one to the other, as seen in Daimler's scaling back of Robotaxi plans. The episode then explores the rise of silicon carbide (SiC) in power electronics, highlighting partnerships between companies like Cree, STMicroelectronics, Soitec, and Applied Materials to overcome manufacturing challenges. Finally, George Leopold and Loring Morbel analyze the 'fitful fit' between AI and academia, arguing that the 'black box' nature of deep learning makes it difficult for universities to meet the quantifiable deliverables required by government and industry funders.

Most relevant to

large enterprises and early-stage companies

Topics

Mentioned

Companies
Daimler AG, Tesla, Cree, STMicroelectronics, Soitec, Applied Materials, DARPA, National Science Foundation, Allen Institute, Atari
Products
Segway, Jarvik 7, Pong
Materials
silicon carbide, gallium nitride

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