Hardware Podcasts

Live from the Global CEO Summit

EE Times Current · 15 Nov 2019 · 40m

What this episode covers

Brian Santo and Junko Yoshida report from the Global CEO Summit in Shenzhen, featuring interviews with executives from Siemens, Graphcore, Qorvo, and AMS. They discuss the strategic shift in the US-China trade war, Texas Instruments' controversial decision to bypass distributors, and Graphcore's novel Intelligence Processing Unit (IPU) architecture. The episode also covers Qorvo's challenges in scaling 5G infrastructure, Siemens' 'closed-loop digital twin' concept, and the convergence of optics and sensors in devices like smartphones and autonomous vehicles.

Most relevant to

large enterprises

Topics

Mentioned

Companies
Siemens, Graphcore, Qorvo, Texas Instruments, AMS, Yole Development
Products
IPU, LIDAR
Tools
Mendix, MindSphere, Poplar, TensorFlow, PyTorch
Also
MEMS

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