Hardware Podcasts

Intel Memory | ST SiC | Exclusive with Greg Travis on Boeing

EE Times Current · 5 Apr 2019 · 19m

What this episode covers

Rick Merritt and Junko Yoshida report on Intel's rollout of 10nm FPGAs and Optane DIMMs, noting that proprietary interconnects may hinder adoption due to customer lock-in concerns. Greg Travis, a software engineer and pilot, argues in an exclusive interview that the Boeing 737 Max's MCAS software should be removed entirely rather than fixed, citing fundamental airframe design flaws and single-sensor dependency. Meanwhile, STMicroelectronics outlines its strategy to capture 30% of the $3.7 billion silicon carbide market by 2025, focusing on supply chain integration with Norstel and cost reduction for EVs. Finally, Yoshida critiques Japanese automakers' risk-averse consortium model, arguing it stifles innovation in mobility services compared to global competitors.

Most relevant to

early-stage companies and large enterprises

Topics

Mentioned

Companies
Intel, Boeing, STMicroelectronics, Norstel, Cree, Monet Technologies
Products
Optane, MCAS
Materials
Silicon Carbide

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