The Spark Gap · 3 Dec 2014 · 47m
Speakers Karl and Corey discuss the critical importance of descriptive net naming in PCB layout, explaining how logical names help identify errors like VBus connecting to ground, whereas arbitrary names like 'N_325' hide mistakes. They cover signal integrity topics including impedance control, stack-up considerations, and the distinction between single-ended and differential signals, noting that fab houses often provide impedance calculators. The conversation concludes with manufacturing details, specifically explaining 'thieving' copper for board stability and 'thermal reliefs' to prevent tombstoning during soldering.
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Dave Jones and Chris Gammell discuss the critical importance of PCB stackups, sharing a story where Chris wasted two days troubleshooting controlled impedance issues caused by a board house using the wrong material. They explore the 'two-person rule' for powering up expensive prototypes, the nuances of writing C vs. C++ for hardware projects, and the industry shift toward onshore manufacturing exemplified by TSMC's new Arizona fab.
Keven Coates, Senior Electrical Engineer at Novium Designs and former Texas Instruments employee, previews his upcoming PCB West presentations on signal integrity, thermal management, and design for manufacturing. He warns engineers against blindly trusting silicon company data sheets and evaluation board layouts, explaining that these are often designed by third parties or driven by customer demands rather than optimal engineering practices. Coates shares specific assembly pitfalls, such as incorrect diode polarity and component placement near V-scored board edges, which can cause catastrophic failures during depanelization.
Zach Peterson hosts Mike Buetow (PCEA), Chrys Shea (Shea Engineering), and Daniel Stanphill (Aurora Boardworks) to preview the circuit assembly track at PCB West 2026. The panel discusses common PCB design-for-manufacturing mistakes, such as using unvalidated datasheet footprints and ignoring padstack constraints, and highlights advanced assembly technologies like placing 2 kg components and 006003 passives. They also cover the importance of networking, talent acquisition, and understanding solder paste and stencil design for successful production.
Chris Denney, CTO of Worthington Assembly and Circuit Hub, explains how PCB design choices directly impact manufacturing efficiency and cost. He details five critical areas for mechanical and electrical engineers: ensuring component polarity is clear on the silk layer, using standardized 'cozy' 1mm text, avoiding panelization conflicts with overhanging parts, maintaining component size consistency to simplify stencil stepping, and preferring green solder mask over black for better optical inspection. Denney emphasizes that manufacturers are not Apple and must work with standard processes, urging designers to provide clear visual cues and collaborate early to avoid expensive rework and delays during new product introduction.
Hosts Dave Jones and Chris Gammell discuss PCB design challenges, specifically the critical importance of specifying solder mask expansion to avoid manufacturing rejections. They analyze the economics of PCB fabrication, the technical complexities of routing BGA packages, and the limitations of sharing ECAD footprint libraries across different tools. The conversation also covers the risks of component obsolescence in hardware startups and critiques the 'verified' badges on crowdfunding platforms like Kickstarter.
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