WFE to the Moon (Still), Semicon West and OCP Insights

What this episode covers

Ben Bajarin and Jay Goldberg recap the semiconductor industry's structural shift, highlighting ASML, TSMC, and Applied Materials' aggressive Capex and innovation in wafer equipment and advanced packaging. They analyze the Open Compute Project (OCP) Summit, focusing on the physical realities of data center infrastructure, including Delta Electronics' liquid cooling manifolds, the 800V DC power transition, and the complex trade-offs between co-packaged optics (CPO) and copper interconnects. The hosts discuss how these hardware constraints are forcing data center operators to make difficult architectural decisions regarding GPU density, rack topology, and the sequencing of technology adoption.