# Ep 160: More good News for Intel, AI Model Trends, Future of Datacenter

- Show: [The Circuit](https://hardwarepodcasts.com/podcast/the-circuit)
- Published: 2026-04-13
- Length: 43m
- Episode: 163
- Page: https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter
- Listen: https://share.transistor.fm/s/e82d4052

## Summary

Ben Bajarin and Jay Goldberg analyze Intel's recent strategic moves, including a partnership with Tesla for its 'Terafab' project and co-design work with Google on its IPU, interpreting these as validation for Intel's advanced packaging and foundry capabilities. They discuss the broader semiconductor market's valuation disconnect, noting how investors are shifting focus from established compute giants to obscure optical and mineral supply chain bottlenecks. The hosts also examine the future of data centers, arguing that extreme co-optimization of power (800 VDC) and cooling is becoming essential to unlock compute capacity, and cover Anthropic's rapid product rollout, including its Word connector and 'Mythos' model, while highlighting rising token costs and capacity constraints.

## Chapters

- [0:05](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=5) Intel's Terafab and Tesla Partnership
- [6:43](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=403) Intel's Momentum and Google IPU Co-design
- [11:44](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=704) Semiconductor Market Valuation and Optical Scarcity
- [19:50](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=1190) Future of Data Centers: 800 VDC and Liquid Cooling
- [30:58](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=1858) Anthropic's Product Rollout and AI Capacity Constraints
- [39:32](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter#t=2372) Rising Cost per Transistor and AI Economics

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Energy & climate tech](https://hardwarepodcasts.com/topic/energy-and-climate-tech)
- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)
- [Sourcing & supply chain](https://hardwarepodcasts.com/topic/sourcing-and-supply-chain)

## Most relevant to

large enterprises

## Mentioned

- Intel (company)
- Tesla (company)
- TSMC (company)
- Samsung (company)
- Google (company)
- Anthropic (company)
- Claude (product)
- NVIDIA (company)
- Schneider Electric (company)
- Mythos (product)
- Opus (product)
- EMIB (product)
- IPU (product)
- 800 VDC (other)
- Tungsten (material)

## Related episodes from other shows

- [Inside Google’s massive AI capex (live)](https://hardwarepodcasts.com/podcast/catalyst/2026-04-23-inside-googles-massive-ai-capex-live) (Catalyst)
- [The State of Multi-Die: Insights and Customer Requirements](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements) (EE Times Current)
- [How Much is Enough for Hyperscale Companies?](https://hardwarepodcasts.com/podcast/ee-times-current/2019-07-26-how-much-is-enough-for-hyperscale-companies) (EE Times Current)
- [Designing the AI Factory from the Rack Up](https://hardwarepodcasts.com/podcast/ee-times-current/2026-08-21-designing-the-ai-factory-from-the-rack-up) (EE Times Current)
- [China’s $28B Big Fund | The Cockiest Startup | Sony’s Ambitions](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-22-chinas-28b-big-fund-the-cockiest-startup-sonys-ambitions) (EE Times Current)

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