# Episode 38: The Future of Transistor Design and Advanced Packaging

- Show: [The Circuit](https://hardwarepodcasts.com/podcast/the-circuit)
- Published: 2023-10-16
- Length: 33m
- Episode: 40
- Page: https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging
- Listen: https://share.transistor.fm/s/96e15039

## Summary

Huiming Bu from IBM Research discusses the future of transistor design and advanced packaging with host Ben Bajarin. They explore the industry's transition from FinFET to nanosheet architectures and the emergence of 3D scaling via Vertical Transport FETs (VTFET) and Stacked FETs (SFET). Bu explains how chiplet technology and heterogeneous integration are accelerating compute density, allowing AMD's MI300X to reach 100 billion transistors seven years ahead of traditional scaling predictions. The conversation highlights the critical need for System Technology Co-optimization (STCO) and new EDA tools to manage the complexity of 2.5D and 3D IC designs.

## Chapters

- [0:07](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=7) Introduction and IBM's Role
- [1:01](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=61) Transistor Scaling: FinFET to Nanosheet and Beyond
- [8:04](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=484) 3D Scaling: VTFET and Stacked FET Architectures
- [13:43](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=823) Chiplets, Advanced Packaging, and Compute Density
- [23:47](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=1427) The Need for STCO and New EDA Tools
- [29:08](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging#t=1748) The 4-Tax Solution and Industry Ecosystem

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [EDA & CAD tools](https://hardwarepodcasts.com/topic/eda-and-cad-tools)
- [Scaling production](https://hardwarepodcasts.com/topic/scaling-production)

## Most relevant to

large enterprises

## Mentioned

- IBM Research (company)
- Intel (company)
- AMD (company)
- MI300X (product)
- Apple (company)
- A17 Pro (product)
- TSMC (company)
- Samsung (company)
- ASML (company)
- EUV (tool)
- NAU (tool)

## Related episodes from other shows

- [Transforming Compute Possibilities with Multi-Die Systems](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems) (EE Times Current)
- [Returning from Mars (Matt Damon Redux) | Apple & the Sun King | Chip Packaging](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging) (EE Times Current)
- [Leading Edge Analog with Joren Vaes](https://hardwarepodcasts.com/podcast/the-amp-hour/2025-10-18-leading-edge-analog-with-joren-vaes) (The Amp Hour)
- [Whither Semiconductors? The Wheels on the Bus Go ‘Round and ‘Round](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-16-whither-semiconductors-the-wheels-on-the-bus-go-round-and-round) (EE Times Current)
- [Discussing Chiplets with Ming Zhang](https://hardwarepodcasts.com/podcast/the-amp-hour/2020-07-05-discussing-chiplets-with-ming-zhang) (The Amp Hour)

## Citing this page

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