# Episode 36: The Wide World of Memory

- Show: [The Circuit](https://hardwarepodcasts.com/podcast/the-circuit)
- Published: 2023-10-02
- Length: 37m
- Episode: 38
- Page: https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory
- Listen: https://share.transistor.fm/s/1d8ab94b

## Summary

Steven Woo, a Fellow at Rambus, explains the fundamental differences between memory and logic, detailing how DRAM innovation is measured by capacity and bandwidth rather than process nodes. He discusses the specific challenges of High Bandwidth Memory (HBM) for AI training, including stacking and power efficiency, and contrasts this with the cost constraints of standard DDR. The conversation covers the massive capital expenditures required for memory fabs, the role of chiplets in increasing package complexity, and the emerging competitive landscape involving Chinese manufacturer CXMT.

## Chapters

- [0:07](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=7) Introduction: Steven Woo and Rambus
- [2:33](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=153) Memory vs. Logic: The Bottleneck Problem
- [4:40](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=280) DRAM Reliability: Row Hammer and Cell Leakage
- [8:02](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=482) Measuring Innovation: DDR, HBM, and Cost Constraints
- [13:00](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=780) HBM Packaging and Vertical Stacking
- [16:42](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=1002) Fab Economics: Micron's $100 Billion Investment
- [21:35](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=1295) AI Drivers: Capacity, Bandwidth, and CXL
- [27:27](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=1647) Training vs. Inference and Chinese Competition
- [33:24](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-02-episode-36-the-wide-world-of-memory#t=2004) Future Milestones for Memory Technologies

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Scaling production](https://hardwarepodcasts.com/topic/scaling-production)
- [Connected products & IoT](https://hardwarepodcasts.com/topic/connected-products-and-iot)
- [Policy, trade & tariffs](https://hardwarepodcasts.com/topic/policy-trade-and-tariffs)

## Most relevant to

large enterprises

## Mentioned

- Rambus (company)
- Micron (company)
- Samsung (company)
- Intel (company)
- AMD (company)
- Nvidia (company)
- CXMT (company)
- HBM (product)
- DDR (product)
- LPDDR (product)
- GDDR (product)
- CXL (product)

## Related episodes from other shows

- [AI and Semiconductor Memory: More, More, More](https://hardwarepodcasts.com/podcast/ee-times-current/2021-10-01-ai-and-semiconductor-memory-more-more-more) (EE Times Current)
- [Designing the AI Factory from the Rack Up](https://hardwarepodcasts.com/podcast/ee-times-current/2026-08-21-designing-the-ai-factory-from-the-rack-up) (EE Times Current)
- [Fixing AI’s Bottlenecks: Memory, Scale, and Sparsity](https://hardwarepodcasts.com/podcast/ee-times-current/2026-04-23-fixing-ais-bottlenecks-memory-scale-and-sparsity) (EE Times Current)
- [TSMC Scraps a Batch of Wafers | AI Limitations | ISSCC](https://hardwarepodcasts.com/podcast/ee-times-current/2019-02-22-tsmc-scraps-a-batch-of-wafers-ai-limitations-isscc) (EE Times Current)
- [Interview: Roboticist Ayanna Howard | Memories May Be Beautiful, And Yet | Math & Neptune](https://hardwarepodcasts.com/podcast/ee-times-current/2020-09-25-interview-roboticist-ayanna-howard-memories-may-be-beautiful-and-yet-math-neptun) (EE Times Current)

## Citing this page

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