# Episode 9: Silicon Trends and Highlights from MWC

- Show: [The Circuit](https://hardwarepodcasts.com/podcast/the-circuit)
- Published: 2023-03-06
- Length: 40m
- Episode: 9
- Page: https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc
- Listen: https://share.transistor.fm/s/85719f63

## Summary

Ben Bajarin and Jay Goldberg discuss the state of the semiconductor and telecom industry at Mobile World Congress (MWC), noting its return to near-pre-pandemic attendance levels. They analyze key trends including the shift toward verticalization in telecom, the competitive landscape of Open RAN silicon involving Qualcomm, Marvell, and Intel, and the growing influence of public cloud providers like Microsoft and AWS in telco core networks. The hosts also highlight specific innovations such as Ixana's body-conducted wireless technology for AR and Wi-Lan's low-cost Bluetooth tags.

## Chapters

- [0:01](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=1) MWC Attendance and Atmosphere
- [2:25](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=145) Telecom Focus and IP Licensing Dynamics
- [10:49](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=649) Verticalization and Semi-Custom Silicon
- [16:12](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=972) Telco Cloud and Public Cloud Partnerships
- [25:06](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=1506) Open RAN Silicon Competition: Qualcomm, Marvell, and Intel
- [34:13](https://hardwarepodcasts.com/podcast/the-circuit/2023-03-06-episode-9-silicon-trends-and-highlights-from-mwc#t=2053) AR/VR Innovations: Ixana and Wi-Lan

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Wireless & RF](https://hardwarepodcasts.com/topic/wireless-and-rf)
- [Policy, trade & tariffs](https://hardwarepodcasts.com/topic/policy-trade-and-tariffs)
- [Connected products & IoT](https://hardwarepodcasts.com/topic/connected-products-and-iot)
- [Scaling production](https://hardwarepodcasts.com/topic/scaling-production)

## Most relevant to

large enterprises

## Mentioned

- Qualcomm (company)
- Nokia (company)
- Ericsson (company)
- Huawei (company)
- Microsoft (company)
- Amazon (company)
- Intel (company)
- Marvell (company)
- Ixana (company)
- Wi-Lan (company)
- Open RAN (other)
- RISC-V (chip)

## Related episodes from other shows

- [Embedded World in Nuremberg | Mobile World Congress in Barcelona](https://hardwarepodcasts.com/podcast/ee-times-current/2019-03-01-embedded-world-in-nuremberg-mobile-world-congress-in-barcelona) (EE Times Current)
- [5G Smartphone ICs | AI and the 4 Clouds | AVs: Competing on Safety](https://hardwarepodcasts.com/podcast/ee-times-current/2019-09-13-5g-smartphone-ics-ai-and-the-4-clouds-avs-competing-on-safety) (EE Times Current)
- [5G & Jetpacks | UWB Rises from the Dead | Bob Swan Profile](https://hardwarepodcasts.com/podcast/ee-times-current/2019-08-09-5g-jetpacks-uwb-rises-from-the-dead-bob-swan-profile) (EE Times Current)
- [Intel CPU |5G Fixed Wireless | AI Silicon Race | SMIC Rift](https://hardwarepodcasts.com/podcast/ee-times-current/2019-03-29-intel-cpu-5g-fixed-wireless-ai-silicon-race-smic-rift) (EE Times Current)
- [Whither Semiconductors? The Wheels on the Bus Go ‘Round and ‘Round](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-16-whither-semiconductors-the-wheels-on-the-bus-go-round-and-round) (EE Times Current)

## Citing this page

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