# Episode 3: Moore's Law and Process vs. Packaging

- Show: [The Circuit](https://hardwarepodcasts.com/podcast/the-circuit)
- Published: 2023-01-16
- Length: 40m
- Episode: 3
- Page: https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging
- Listen: https://share.transistor.fm/s/3bee214f

## Summary

Ben Bajarin and Jay Goldberg discuss the economic and technological challenges facing semiconductor foundries like Intel, TSMC, and Samsung as Moore's Law slows. They analyze Intel's loss of process leadership, Samsung's structural challenges in the 3nm era, and the shifting industry focus from raw transistor density to advanced packaging and chiplet architectures. The hosts also explore how vertical integration gives Apple a competitive advantage over companies like Intel and Qualcomm that must serve broader, lower-common-denominator markets.

## Chapters

- [0:01](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=1) Introduction: Moore's Law and Intel's Decline
- [2:04](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=124) The Economics of Moore's Law and Intel's Foundry Strategy
- [11:21](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=681) Process Technology: FinFET, Gate-All-Around, and Yield Challenges
- [16:17](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=977) Samsung's Foundry Prospects and TSMC's Dominance
- [23:29](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=1409) Advanced Packaging and Chiplets as the New Frontier
- [31:10](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging#t=1870) Vertical Integration: Apple vs. Intel and Qualcomm

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Pricing, margins & unit economics](https://hardwarepodcasts.com/topic/pricing-and-unit-economics)
- [Industrial & consumer product design](https://hardwarepodcasts.com/topic/industrial-design)

## Most relevant to

large enterprises

## Mentioned

- Intel (company)
- TSMC (company)
- Samsung (company)
- Apple (company)
- Qualcomm (company)
- AMD (company)
- NVIDIA (company)
- GlobalFoundries (company)
- UMC (company)
- FinFET (other)
- Gate-All-Around (other)
- RibbonFET (other)
- M1 (product)
- Snapdragon 8 (product)
- MI 100 (product)

## Related episodes from other shows

- [Whither Semiconductors? The Wheels on the Bus Go ‘Round and ‘Round](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-16-whither-semiconductors-the-wheels-on-the-bus-go-round-and-round) (EE Times Current)
- [Headline: Intel Throws a Curveball | The Book on Gallium Nitride](https://hardwarepodcasts.com/podcast/ee-times-current/2021-03-26-headline-intel-throws-a-curveball-the-book-on-gallium-nitride) (EE Times Current)
- [ON Semi’s Acquisition | TSMC’s Finer Nodes | Tesla’s AI Chip | China’s Fabless Companies](https://hardwarepodcasts.com/podcast/ee-times-current/2019-04-26-on-semis-acquisition-tsmcs-finer-nodes-teslas-ai-chip-chinas-fabless-companies) (EE Times Current)
- [IMEC & the End of the Road(map) | EDS and the Trade War | Restoring Notre Dame](https://hardwarepodcasts.com/podcast/ee-times-current/2019-05-17-imec-the-end-of-the-road-map-eds-and-the-trade-war-restoring-notre-dame) (EE Times Current)
- [The CHIP Act’s Blind Spot | A Lifeline for Intel | I Just Saw a Face](https://hardwarepodcasts.com/podcast/ee-times-current/2020-07-31-the-chip-acts-blind-spot-a-lifeline-for-intel-i-just-saw-a-face) (EE Times Current)

## Citing this page

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