# Advanced Packaging & Chiplet Design with Chipletz

- Show: [OnTrack](https://hardwarepodcasts.com/podcast/ontrack)
- Published: 2026-03-13
- Length: 37m
- Episode: 335
- Page: https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz
- Listen: https://podcast.altium.com/e/advanced-packaging-chiplet-design-with-chipletz/

## Summary

Stephen Newberry, Victor Kronberg, and Ching-Ping Wong from Chipletz, a fabless advanced packaging company, discuss their technical paper presented at DesignCon on the wallstrip transmission line. They explain how this novel die-to-die interconnect structure eliminates the need for a silicon interposer, reducing layer count and cost while improving insertion loss and enabling higher data rates (up to 58 GT/s) for UCIE interfaces. The team highlights the signal integrity challenges of managing crosstalk in this tall, vertical trace configuration and discusses the significant hurdles preventing an open chiplet marketplace, such as lack of standardization and limited assembly capabilities for fine-pitch dies.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=0) Introduction: Guest backgrounds and Chipletz overview
- [4:11](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=251) Wallstrip transmission line and UCIE performance benefits
- [8:39](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=519) Substrate materials and eliminating silicon interposers
- [13:12](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=792) Challenges for an open chiplet marketplace
- [18:24](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=1104) Substrate materials and UHDI PCB convergence
- [21:19](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=1279) Signal integrity: Wallstrip vs. microstrip/stripline
- [28:05](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=1685) Multi-layer routing and crosstalk management
- [32:06](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz#t=1926) PCB designer transition to advanced packaging

## Topics

- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Materials & manufacturing processes](https://hardwarepodcasts.com/topic/materials-and-processes)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)

## Most relevant to

early-stage companies

## Mentioned

- Chipletz (company)
- DesignCon (other)
- UCIE (other)
- Siemens (company)
- Minor Graphics (company)
- Digi-Key (other)
- Calumet (company)

## Related episodes from other shows

- [The Impact of UCIe on Multi-Die Systems](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems) (EE Times Current)
- [Discussing Chiplets with Ming Zhang](https://hardwarepodcasts.com/podcast/the-amp-hour/2020-07-05-discussing-chiplets-with-ming-zhang) (The Amp Hour)
- [Compact High Speed Design with Lukas Henkel](https://hardwarepodcasts.com/podcast/the-amp-hour/2024-10-31-compact-high-speed-design-with-lukas-henkel) (The Amp Hour)
- [322: Learn Assembly Code](https://hardwarepodcasts.com/podcast/embedded-fm/2020-02-28-322-learn-assembly-code) (Embedded.fm)
- [Episode 38: The Future of Transistor Design and Advanced Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging) (The Circuit)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to OnTrack.