# UHDI, AI, and Solder Paste Innovation

- Show: [OnTrack](https://hardwarepodcasts.com/podcast/ontrack)
- Published: 2025-02-04
- Length: 51m
- Episode: 289
- Page: https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation
- Listen: https://podcast.altium.com/e/uhdi-ai-and-solder-paste-innovation/

## Summary

Tony Lentz, Chemist and Field Application Engineer at FCT Assembly, discusses the technical challenges of Ultra-High Density Interconnect (UHDI) PCB assembly with host Zach Peterson. They cover the necessity of Type 6 and Type 7 solder powders for fine-pitch components, the resulting issues with oxidation, flux residue, and dendritic growth, and the critical role of cleaning and precise equipment calibration in maintaining yield.

## Chapters

- [1:09](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=69) UHDI Symposium Impressions and Additive Manufacturing Limits
- [4:31](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=271) Solder Powder Types and Aperture Constraints
- [10:37](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=637) Oxidation, Graping, and the Necessity of Cleaning
- [19:37](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=1177) Electrochemical Failure and Dendritic Growth
- [25:29](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=1529) Voiding Mechanisms and Flux Chemistry
- [31:03](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=1863) Assembly Challenges: Printer Alignment and Pick-and-Place
- [43:23](https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation#t=2603) Low Temperature Solders for BGA and Rework

## Topics

- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Materials & manufacturing processes](https://hardwarepodcasts.com/topic/materials-and-processes)
- [Debugging & failure analysis](https://hardwarepodcasts.com/topic/debugging-and-failure-analysis)
- [Design for manufacturing & NPI](https://hardwarepodcasts.com/topic/design-for-manufacturing)

## Most relevant to

established companies

## Mentioned

- FCT Assembly (company)
- SMTA (company)
- Digi-Key (company)
- Autotech (company)
- SAC 305 (material)

## Related episodes from other shows

- [Toasted Marshmallow Connectors](https://hardwarepodcasts.com/podcast/the-amp-hour/2021-09-20-toasted-marshmallow-connectors) (The Amp Hour)
- [How Defense Demand And HDI Capacity Are Reshaping Europe’s PCB Industry with Polytron-Print's Michael Müller](https://hardwarepodcasts.com/podcast/ems-c-level/2026-02-24-how-defense-demand-and-hdi-capacity-are-reshaping-europes-pcb-industry-with-poly) (EMS@C-LEVEL)
- [I've bitten myself](https://hardwarepodcasts.com/podcast/the-amp-hour/2018-05-21-ive-bitten-myself) (The Amp Hour)
- [Integrating Hardware and Software Teams](https://hardwarepodcasts.com/podcast/oxide-and-friends/2022-07-12-integrating-hardware-and-software-teams) (Oxide and Friends)
- [Ergs Per Second](https://hardwarepodcasts.com/podcast/the-amp-hour/2018-11-11-ergs-per-second) (The Amp Hour)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ontrack/2025-02-04-uhdi-ai-and-solder-paste-innovation. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to OnTrack.