Hardware Podcasts

EMS@C-LEVEL Season #2021 Episode #6 with Case Engelen, CEO of TITOMA

EMS@C-LEVEL · 9 Aug 2021 · 25m

What this episode covers

Case Engelen, CEO of TITOMA, explains how his company helps Western electronics firms navigate component shortages by designing for disruption, such as parallel-designing Bluetooth modules and reserving PCB space for MCU changes. He discusses the 'China Plus' strategy, noting that while final assembly may move to Southeast Asia or Taiwan to avoid tariffs, China’s deep component infrastructure remains irreplaceable for the next 5-10 years. Engelen highlights the 'whiplash effect' in ordering, where manufacturers hoard inventory from IC makers, creating market distortion and forcing clients to order components years in advance.

Most relevant to

companies scaling up

Topics

Mentioned

Companies
TITOMA, Xiaomi, Opo, Foxconn, Flextronics
Chips
NRF, STM32

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