# Automated Multiphysics for 3D IC Success

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2026-03-06
- Length: 28m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success
- Listen: https://podcast.show/aspencore/episode/152679386/

## Summary

Chevanoki and John Ferguson from Siemens EDA discuss the challenges of automated multiphysics analysis for 3D IC design, specifically how power, heat, and stress interact in stacked heterogeneous architectures. They explain the shift from traditional 2D verification to integrated flows that account for GDS-level details, thermal impacts, and mechanical stresses to ensure timing closure and reliability. The guests highlight the importance of standards like 3D-BC, the use of Siemens' Calibre and Flowtherm tools, and the future role of AI in reducing the steep learning curve for designers moving into 3D stacking.

## Chapters

- [0:03](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=3) Introduction: Chevanoki and John Ferguson on 3D IC Challenges
- [1:53](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=113) New Challenges in 3D Stacking: Heterogeneous Processes and Data
- [4:18](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=258) Collaboration and Shift-Left Multi-Physics Analysis
- [6:28](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=388) Integrated Flows: Calibre and Flowtherm for Thermal Modeling
- [11:46](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=706) Timing Closure and the Failure of 'Known Good Die'
- [14:54](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=894) Stress Impacts and 3D-BC Standards for Chiplets
- [23:30](https://hardwarepodcasts.com/podcast/ee-times-current/2026-03-06-automated-multiphysics-for-3d-ic-success#t=1410) Future Trends: Photonics, New Materials, and AI Automation

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [EDA & CAD tools](https://hardwarepodcasts.com/topic/eda-and-cad-tools)
- [Mechanical engineering](https://hardwarepodcasts.com/topic/mechanical-engineering)
- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)

## Most relevant to

large enterprises

## Mentioned

- Siemens EDA (company)
- Calibre (product)
- Flowtherm (product)
- 3D-BC (other)
- TSMC (company)
- IEEE (company)

## Related episodes from other shows

- [Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations](https://hardwarepodcasts.com/podcast/moores-lobby/2026-09-22-inside-a-multi-billion-ip-engine-driving-ic-and-eda-innovations) (Moore's Lobby)
- [Episode 38: The Future of Transistor Design and Advanced Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging) (The Circuit)
- [Episode 67: A Conversation with Aart de Geus on EDA and the Future of Silicon Design](https://hardwarepodcasts.com/podcast/the-circuit/2024-05-13-episode-67-a-conversation-with-aart-de-geus-on-eda-and-the-future-of-silicon-des) (The Circuit)
- [Downward Sloping Trace](https://hardwarepodcasts.com/podcast/the-amp-hour/2019-03-31-downward-sloping-trace) (The Amp Hour)
- [Synopsys' Stelios Diamantidis Is Bringing the Magic of AI To Chip Design](https://hardwarepodcasts.com/podcast/moores-lobby/2023-04-04-synopsys-stelios-diamantidis-is-bringing-the-magic-of-ai-to-chip-design) (Moore's Lobby)

## Citing this page

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