# Chips at the Edge: Innovation for AI at Edge and Automotive

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2026-01-14
- Length: 25m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive
- Listen: https://podcast.show/aspencore/episode/150755580/

## Summary

Hezzy Tzar, Executive Director at Synopsys, discusses the shift of AI workloads from the cloud to the edge, highlighting the critical balance of power, performance, and cost in devices like smartphones and automotive systems. He explains that memory bandwidth, specifically involving LPDDR6 and UFS, is the primary bottleneck for on-device AI, necessitating flexible multi-die architectures and standards like UCIe to manage scalability and reliability in automotive applications. Tzar emphasizes the importance of 'shift left' methodologies, using emulation and FPGA prototyping to handle rapid model changes, and predicts a future where hardware must support continuous software upgrades and subscription-based models for physical AI devices like robotics.

## Chapters

- [0:03](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=3) Introduction: Hezzy Tzar and Synopsys
- [1:27](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=87) Edge AI Economics and the Memory Bottleneck
- [6:27](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=387) Design Challenges: Flexibility and Software-First Approaches
- [10:13](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=613) Multi-Die Architecture in Automotive vs. HPC
- [13:53](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=833) UCIe Standards and Die-to-Die Connectivity
- [18:02](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=1082) Future Opportunities: Software-Defined Hardware and Robotics
- [23:24](https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive#t=1404) Sustainability and Power Consumption of Edge AI

## Topics

- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)
- [Microcontrollers & dev platforms](https://hardwarepodcasts.com/topic/microcontrollers-and-platforms)
- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Embedded firmware](https://hardwarepodcasts.com/topic/embedded-firmware)
- [Energy & climate tech](https://hardwarepodcasts.com/topic/energy-and-climate-tech)

## Most relevant to

large enterprises

## Mentioned

- Synopsys (company)
- UCIe (other)
- LPDDR6 (other)
- UFS (other)
- Astra (company)

## Related episodes from other shows

- [235. Arm’s Vince Jesaitis on How AI Is Moving from the Cloud to Your Pocket](https://hardwarepodcasts.com/podcast/the-next-byte-podcast/2025-12-09-235-arms-vince-jesaitis-on-how-ai-is-moving-from-the-cloud-to-your-pocket) (The Next Byte Podcast)
- [Episode 19: The On-Device AI Debate](https://hardwarepodcasts.com/podcast/the-circuit/2023-05-22-episode-19-the-on-device-ai-debate) (The Circuit)
- [#004: The Future of Edge AI and What it Means for Device Makers](https://hardwarepodcasts.com/podcast/coredump-sessions/2025-02-25-004-the-future-of-edge-ai-and-what-it-means-for-device-makers) (Coredump Sessions)
- [145. The Prius of Artificial Intelligence: Hybrid AI Models](https://hardwarepodcasts.com/podcast/the-next-byte-podcast/2023-10-24-145-the-prius-of-artificial-intelligence-hybrid-ai-models) (The Next Byte Podcast)
- [AI at the Edge: Justin Schneck on the Future of Embedded Devices](https://hardwarepodcasts.com/podcast/over-the-air/2025-05-29-ai-at-the-edge-justin-schneck-on-the-future-of-embedded-devices) (Over the Air)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ee-times-current/2026-01-14-chips-at-the-edge-innovation-for-ai-at-edge-and-automotive. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to EE Times Current.