# The State of Multi-Die: Insights and Customer Requirements

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2025-11-07
- Length: 20m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements
- Listen: https://podcast.show/aspencore/episode/149728442/

## Summary

Shaker Kapur, Executive Director of Productline Management for the Synopsys EDA Group, discusses the industry shift toward multi-die design driven by the strategic collaboration between OpenAI and AMD. He explains how this partnership, involving up to 6 gigawatts of AMD Instinct GPUs, highlights the necessity of co-optimizing hardware and software to meet exploding AI compute demands. Kapur details how Synopsys addresses these challenges through its 3DIC Capital platform, which unifies multi-die architecture exploration and system-level analysis to enable scalable, power-efficient data center architectures.

## Chapters

- [0:03](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=3) Introduction: Shaker Kapur and the OpenAI-AMD Partnership
- [1:32](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=92) The Feedback Loop: AI Hardware and Software Convergence
- [4:30](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=270) Drivers of Convergence: Pure Demand and Strategic Imperative
- [6:59](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=419) Multi-Die as the Viable Path for AI Progress
- [9:30](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=570) Scaling Multi-Die from Niche to Norm
- [11:58](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=718) New Standards for AI Data Centers and Compute Fabric
- [15:07](https://hardwarepodcasts.com/podcast/ee-times-current/2025-11-07-the-state-of-multi-die-insights-and-customer-requirements#t=907) Synopsys 3DIC Capital and Automation in System Design

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)
- [EDA & CAD tools](https://hardwarepodcasts.com/topic/eda-and-cad-tools)
- [Mechanical engineering](https://hardwarepodcasts.com/topic/mechanical-engineering)

## Most relevant to

large enterprises

## Mentioned

- Synopsys (company)
- OpenAI (company)
- AMD (company)
- MI 450 series (product)
- 3DIC Capital (product)
- Answers (product)

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- [Ep 160: More good News for Intel, AI Model Trends, Future of Datacenter](https://hardwarepodcasts.com/podcast/the-circuit/2026-04-13-ep-160-more-good-news-for-intel-ai-model-trends-future-of-datacenter) (The Circuit)
- [AMD's MI300 and the Future of Accelerated Compute](https://hardwarepodcasts.com/podcast/oxide-and-friends/2023-12-12-amds-mi300-and-the-future-of-accelerated-compute) (Oxide and Friends)
- [EP 137: OpenAI + AMD, Intel Tech Touch, QCOM buys Arduino](https://hardwarepodcasts.com/podcast/the-circuit/2025-10-13-ep-137-openai-amd-intel-tech-touch-qcom-buys-arduino) (The Circuit)
- [Episode 81: Chatting With AMD's Forrest Norrod EVP Datacenter Solutions about Buying ZT Systems](https://hardwarepodcasts.com/podcast/the-circuit/2024-08-26-episode-81-chatting-with-amds-forrest-norrod-evp-datacenter-solutions-about-buyi) (The Circuit)

## Citing this page

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