# The State of Multi-Die Testing: Essential Insights for Designers

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2025-05-30
- Length: 26m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers
- Listen: https://podcast.show/aspencore/episode/145896723/

## Summary

Faisal Goriawala, principal product manager at Synopsys, explains the complexities of multi-die testing for 2.5D and 3DIC packages, distinguishing it from traditional monolithic testing by highlighting the need for pre-bond, mid-bond, and post-bond stages. He details how IEEE 1838 standardizes access to DFT and security features across chiplets, enabling Silicon Lifecycle Management (SLM) for in-field health monitoring and predictive maintenance. Goriawala cites Synopsys' collaboration with TSMC on a 2.5D demo vehicle and a success story with Socionex, where SLM solutions enabled high-speed HBM testing and repair without impacting logic die size.

## Chapters

- [0:03](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=3) Introduction: Faisal Goriawala and Multi-Die Testing Overview
- [2:19](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=139) Defining Multi-Die: 2.5D, 3DIC, and Known Good Die
- [5:01](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=301) Multi-Die vs. Monolithic Testing: JTAG and Die-to-Die Links
- [7:26](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=446) IEEE 1838 and P3405 Standards for Chiplet DFT
- [11:01](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=661) Silicon Lifecycle Management (SLM) and In-Field Testing
- [13:12](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=792) Future Vision: Analytics, Monitoring, and Predictive Maintenance
- [15:54](https://hardwarepodcasts.com/podcast/ee-times-current/2025-05-30-the-state-of-multi-die-testing-essential-insights-for-designers#t=954) Ecosystem Success: Synopsys, TSMC, and Socionex Case Study

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Quality & yield](https://hardwarepodcasts.com/topic/quality-and-yield)
- [Certification & compliance](https://hardwarepodcasts.com/topic/certification-and-compliance)

## Most relevant to

large enterprises

## Mentioned

- Synopsys (company)
- TSMC (company)
- Socionex (company)
- ARM (company)
- IEEE 1838 (other)
- UCIe (other)
- HBM (other)
- TestMax (product)
- STAR (product)

## Related episodes from other shows

- [Advanced Packaging & Chiplet Design with Chipletz](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz) (OnTrack)
- [Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations](https://hardwarepodcasts.com/podcast/moores-lobby/2026-09-22-inside-a-multi-billion-ip-engine-driving-ic-and-eda-innovations) (Moore's Lobby)
- [Episode 111: Talking Chips and Wafers with Chips and Wafers](https://hardwarepodcasts.com/podcast/the-circuit/2025-03-31-episode-111-talking-chips-and-wafers-with-chips-and-wafers) (The Circuit)
- [Daaaamn We're Duuuummmb](https://hardwarepodcasts.com/podcast/the-amp-hour/2023-07-17-daaaamn-were-duuuummmb) (The Amp Hour)
- [322: Learn Assembly Code](https://hardwarepodcasts.com/podcast/embedded-fm/2020-02-28-322-learn-assembly-code) (Embedded.fm)

## Citing this page

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