# The Impact of UCIe on Multi-Die Systems

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2023-03-31
- Length: 21m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems
- Listen: https://podcast.show/aspencore/episode/95236498/

## Summary

Manmeet Walia, Product Management Director at Synopsys, explains how the Universal Chiplet Interconnect Express (UCIe) standard addresses die-to-die connectivity challenges in multi-die systems. He details the technical metrics of PPA+L (Power, Performance, Area, Latency) and contrasts UCIe with proprietary standards like NVLink and other alliances like OIF and OCP. Walia discusses the evolving packaging landscape, from organic substrates to interposers, and highlights Synopsys' comprehensive EDA and IP portfolio designed to support this transition across server, AI, and automotive applications.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=0) Introduction and Industry Headlines
- [2:27](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=147) The Rise of Multi-Die Systems and Key Challenges
- [4:56](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=296) Technical Metrics: PPA+L and Interoperability
- [6:43](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=403) UCIe vs. Proprietary Standards and Alliances
- [8:35](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=515) UCIe Ecosystem and Future Evolution
- [12:03](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=723) Applications in Server, AI, and Automotive
- [14:00](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=840) Synopsys' UCIe Portfolio and Full-Stack Solutions
- [17:34](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems#t=1054) Packaging Technologies: Substrates, Interposers, and 3D

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Scaling production](https://hardwarepodcasts.com/topic/scaling-production)
- [Design for manufacturing & NPI](https://hardwarepodcasts.com/topic/design-for-manufacturing)
- [EDA & CAD tools](https://hardwarepodcasts.com/topic/eda-and-cad-tools)

## Most relevant to

large enterprises

## Mentioned

- Synopsys (company)
- UCIe (other)
- Nvidia (company)
- ASML (company)
- Applied Materials (company)
- Intel (company)
- AMD (company)
- Apple (company)
- Amazon (company)
- NVLink (other)
- OCP (other)
- OIF (other)
- Chips Alliance (other)
- AIB (other)
- TSMC (company)
- Samsung (company)
- ASE (company)
- Zebu (product)

## Related episodes from other shows

- [Advanced Packaging & Chiplet Design with Chipletz](https://hardwarepodcasts.com/podcast/ontrack/2026-03-13-advanced-packaging-chiplet-design-with-chipletz) (OnTrack)
- [Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations](https://hardwarepodcasts.com/podcast/moores-lobby/2026-09-22-inside-a-multi-billion-ip-engine-driving-ic-and-eda-innovations) (Moore's Lobby)
- [Discussing Chiplets with Ming Zhang](https://hardwarepodcasts.com/podcast/the-amp-hour/2020-07-05-discussing-chiplets-with-ming-zhang) (The Amp Hour)
- [322: Learn Assembly Code](https://hardwarepodcasts.com/podcast/embedded-fm/2020-02-28-322-learn-assembly-code) (Embedded.fm)
- [Daaaamn We're Duuuummmb](https://hardwarepodcasts.com/podcast/the-amp-hour/2023-07-17-daaaamn-were-duuuummmb) (The Amp Hour)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-31-the-impact-of-ucie-on-multi-die-systems. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to EE Times Current.