# Transforming Compute Possibilities with Multi-Die Systems

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2023-03-03
- Length: 24m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems
- Listen: https://podcast.show/aspencore/episode/94393492/

## Summary

Shekhar Kapoor, Senior Director of Product Line Management at Synopsys, explains the industry's shift from monolithic SoCs to multi-die systems, driven by the limits of Moore's Law and the demand for high-performance computing. He details how technologies like 3D stacking, fan-out wafer scale, and the UCIE standard enable modular, heterogeneous integration for products like the Apple iPhone 15 camera and Tesla's Autopilot. Kapoor highlights Synopsys' role in providing the TDC compiler and comprehensive IP portfolios to facilitate this transition, noting over 100 active multi-die designs currently in development across AI, automotive, and data center markets.

## Chapters

- [0:02](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=2) Introduction: Shekhar Kapoor and Synopsys
- [2:26](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=146) The Multi-Die Inflection Point and Drivers
- [5:40](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=340) Real-World Examples: Apple, Tesla, and AI
- [9:15](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=555) Multi-Die vs. Monolithic SoC Architecture
- [13:08](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=788) The Multi-Die Ecosystem and Synopsys' Role
- [19:55](https://hardwarepodcasts.com/podcast/ee-times-current/2023-03-03-transforming-compute-possibilities-with-multi-die-systems#t=1195) Synopsys Solutions: TDC Compiler and UCIE

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)
- [Industrial & consumer product design](https://hardwarepodcasts.com/topic/industrial-design)

## Most relevant to

large enterprises

## Mentioned

- Synopsys (company)
- Apple (company)
- Tesla (company)
- AMD (company)
- Intel (company)
- Sony (company)
- UCIE (other)
- TDC Compiler (tool)

## Related episodes from other shows

- [Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations](https://hardwarepodcasts.com/podcast/moores-lobby/2026-09-22-inside-a-multi-billion-ip-engine-driving-ic-and-eda-innovations) (Moore's Lobby)
- [Episode 38: The Future of Transistor Design and Advanced Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging) (The Circuit)
- [Episode 67: A Conversation with Aart de Geus on EDA and the Future of Silicon Design](https://hardwarepodcasts.com/podcast/the-circuit/2024-05-13-episode-67-a-conversation-with-aart-de-geus-on-eda-and-the-future-of-silicon-des) (The Circuit)
- [Episode 111: Talking Chips and Wafers with Chips and Wafers](https://hardwarepodcasts.com/podcast/the-circuit/2025-03-31-episode-111-talking-chips-and-wafers-with-chips-and-wafers) (The Circuit)
- [Ep. 43 | Mark Papermaster: The EE and Exec Behind Apple, IBM, Cisco, and AMD's Success](https://hardwarepodcasts.com/podcast/moores-lobby/2022-04-12-ep-43-mark-papermaster-the-ee-and-exec-behind-apple-ibm-cisco-and-amds-success) (Moore's Lobby)

## Citing this page

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